XR16M2650IL32
vs
XR16M2651IM48
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
EXAR CORP
|
EXAR CORP
|
| Part Package Code |
QFN
|
QFP
|
| Package Description |
5 X 5 MM, 0.90 MM HEIGHT, QFN-32
|
7 X 7 MM, 1 MM HEIGHT, TQFP-48
|
| Pin Count |
32
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO OPERATES AT 1.8V OR 2.5V SUPPLY
|
ALSO OPERATES AT 1.8V OR 2.5V SUPPLY
|
| Address Bus Width |
3
|
3
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
64 MHz
|
64 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
| Data Transfer Rate-Max |
2 MBps
|
2 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-XQCC-N32
|
S-PQFP-G48
|
| Length |
5 mm
|
7 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Serial I/Os |
2
|
2
|
| Number of Terminals |
32
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
TFQFP
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
TQFP48,.35SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Max |
3.63 V
|
3.63 V
|
| Supply Voltage-Min |
2.97 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare XR16M2650IL32 with alternatives
Compare XR16M2651IM48 with alternatives