XQVR1000-4CG560Q
vs
XQV1000-4CG560Q
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
CGA
CGA
Package Description
HEAT SINK, CERAMIC, CGA-560
HCGA,
Pin Count
560
560
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-CBGA-X560
S-CBGA-X560
JESD-609 Code
e0
e0
Length
42.5 mm
42.5 mm
Number of CLBs
6144
6144
Number of Equivalent Gates
1124022
1124022
Number of Inputs
404
Number of Logic Cells
27648
Number of Outputs
404
Number of Terminals
560
560
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
6144 CLBS, 1124022 GATES
6144 CLBS, 1124022 GATES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
HCGA
HCGA
Package Equivalence Code
CGA560,33X33,50
CGA560,33X33,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY, HEAT SINK/SLUG
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
MIL-PRF-38535 Class Q
Seated Height-Max
4.9 mm
4.9 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
UNSPECIFIED
UNSPECIFIED
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Total Dose
100k Rad(Si) V
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
Combinatorial Delay of a CLB-Max
0.8 ns
Compare XQVR1000-4CG560Q with alternatives
Compare XQV1000-4CG560Q with alternatives