XQV1000E-6BGG560N vs XCV1000-6BG560I feature comparison

XQV1000E-6BGG560N AMD

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XCV1000-6BG560I AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description PLASTIC, BGA-560 BGA-560
Reach Compliance Code compliant not_compliant
Clock Frequency-Max 357.2 MHz 333 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.6 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 1569178 1124022
Number of Logic Cells 27648 27648
Number of Terminals 560 560
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 6144 CLBS, 1569178 GATES 6144 CLBS, 1124022 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.89 V 2.625 V
Supply Voltage-Min 1.71 V 2.375 V
Supply Voltage-Nom 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 2 1
Pbfree Code No
Part Package Code BGA
Pin Count 560
HTS Code 8542.39.00.01
Number of Inputs 404
Number of Outputs 404
Package Equivalence Code BGA560,33X33,50

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