XQV1000E-6BGG560N
vs
5962R9957401NUA
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
PLASTIC, BGA-560
|
PLASTIC, BGA-560
|
| Reach Compliance Code |
compliant
|
unknown
|
| Clock Frequency-Max |
357.2 MHz
|
|
| Combinatorial Delay of a CLB-Max |
0.47 ns
|
|
| JESD-30 Code |
S-PBGA-B560
|
S-PBGA-B560
|
| JESD-609 Code |
e1
|
e0
|
| Length |
42.5 mm
|
42.5 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
6144
|
|
| Number of Equivalent Gates |
1569178
|
1124022
|
| Number of Logic Cells |
27648
|
27648
|
| Number of Terminals |
560
|
560
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
6144 CLBS, 1569178 GATES
|
1124022 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Supply Voltage-Max |
1.89 V
|
2.625 V
|
| Supply Voltage-Min |
1.71 V
|
2.375 V
|
| Supply Voltage-Nom |
1.8 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
42.5 mm
|
42.5 mm
|
| Base Number Matches |
2
|
2
|
| Number of Inputs |
|
404
|
| Number of Outputs |
|
404
|
| Package Equivalence Code |
|
BGA560,33X33,50
|
| Screening Level |
|
MIL-PRF-38535
|
|
|
|