XQV1000-4CGG560Q
vs
XQVR1000-4CGG560M
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
XILINX INC
|
| Package Description |
CERAMIC, CGA-560
|
HCGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| Combinatorial Delay of a CLB-Max |
0.8 ns
|
|
| JESD-30 Code |
S-CBGA-X560
|
S-CBGA-X560
|
| JESD-609 Code |
e3
|
e3
|
| Length |
42.5 mm
|
42.5 mm
|
| Number of CLBs |
6144
|
6144
|
| Number of Equivalent Gates |
1124022
|
1124022
|
| Number of Logic Cells |
27648
|
|
| Number of Terminals |
560
|
560
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
6144 CLBS, 1124022 GATES
|
6144 CLBS, 1124022 GATES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
HCGA
|
HCGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class Q
|
|
| Seated Height-Max |
4.9 mm
|
4.9 mm
|
| Supply Voltage-Max |
2.625 V
|
2.625 V
|
| Supply Voltage-Min |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
UNSPECIFIED
|
UNSPECIFIED
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
42.5 mm
|
42.5 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
CGA
|
| Pin Count |
|
560
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.39.00.01
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|
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