XQV1000-4BG560N vs XCV1000E-8BG560I feature comparison

XQV1000-4BG560N AMD Xilinx

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XCV1000E-8BG560I AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-560 BGA-560
Pin Count 560 560
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.8 ns 0.4 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e0 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 1124022 331776
Number of Inputs 404 404
Number of Logic Cells 27648 27648
Number of Outputs 404 404
Number of Terminals 560 560
Operating Temperature-Max 125 °C 100 °C
Operating Temperature-Min -55 °C -40 °C
Organization 6144 CLBS, 1124022 GATES 6144 CLBS, 331776 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50 BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 2.625 V 1.89 V
Supply Voltage-Min 2.375 V 1.71 V
Supply Voltage-Nom 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Clock Frequency-Max 416 MHz

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