XQKU5P-L1SFRB784I vs XCKU5P-L1SFVB784I feature comparison

XQKU5P-L1SFRB784I AMD Xilinx

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XCKU5P-L1SFVB784I AMD Xilinx

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2019-04-08 2016-06-03
JESD-30 Code S-PBGA-B784 S-PBGA-B784
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 4 4
Number of CLBs 27120 27120
Number of Inputs 304 304
Number of Logic Cells 474600 474600
Number of Outputs 304 304
Number of Terminals 784 784
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 27120 CLBS 27120 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA784,28X28,32 BGA784,28X28,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Screening Level MIL-PRF-38535
Seated Height-Max 3.52 mm 3.32 mm
Supply Voltage-Max 0.742 V 0.742 V
Supply Voltage-Min 0.698 V 0.698 V
Supply Voltage-Nom 0.72 V 0.72 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 30
Width 23 mm 23 mm
Base Number Matches 1 1
Rohs Code Yes
Factory Lead Time 52 Weeks
Additional Feature IT ALSO OPERATES AT 0.85 V

Compare XQKU5P-L1SFRB784I with alternatives

Compare XCKU5P-L1SFVB784I with alternatives