XQ6VSX315T-1LFFG1156M
vs
XQ6VSX315T-1LRFG1156I
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
|
Combinatorial Delay of a CLB-Max |
0.85 ns
|
0.85 ns
|
JESD-30 Code |
S-PBGA-B1156
|
S-PBGA-B1156
|
JESD-609 Code |
e1
|
e0
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
4
|
|
Number of CLBs |
24600
|
24600
|
Number of Inputs |
600
|
600
|
Number of Logic Cells |
314880
|
314880
|
Number of Outputs |
600
|
600
|
Number of Terminals |
1156
|
1156
|
Operating Temperature-Max |
125 °C
|
100 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Organization |
24600 CLBS
|
24600 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1156,34X34,40
|
BGA1156,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
3.5 mm
|
3.53 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
2
|
2
|
Package Description |
|
FBGA-1156
|
Supply Voltage-Max |
|
0.93 V
|
Supply Voltage-Min |
|
0.87 V
|
Supply Voltage-Nom |
|
0.9 V
|
|
|
|
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