XQ6VSX315T-1FFG1156C
vs
XQ6VSX315T-1RF1156E
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Package Description |
35 X 35 MM, LEAD FREE, FBGA-1156
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Combinatorial Delay of a CLB-Max |
0.79 ns
|
|
| JESD-30 Code |
S-PBGA-B1156
|
|
| JESD-609 Code |
e1
|
e0
|
| Length |
35 mm
|
|
| Moisture Sensitivity Level |
4
|
|
| Number of CLBs |
24600
|
|
| Number of Terminals |
1156
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
24600 CLBS
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA1156,34X34,40
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
3.53 mm
|
|
| Supply Voltage-Max |
1.05 V
|
|
| Supply Voltage-Min |
0.95 V
|
|
| Supply Voltage-Nom |
1 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
TIN LEAD
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
35 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XQ6VSX315T-1FFG1156C with alternatives
Compare XQ6VSX315T-1RF1156E with alternatives