XQ6VLX130T-1FFG1156I
vs
XQ6VLX130T-1RF1156E
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
35 X 35 MM, LEAD FREE, FBGA-1156
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
1098 MHz
|
|
| Combinatorial Delay of a CLB-Max |
0.79 ns
|
|
| JESD-30 Code |
S-PBGA-B1156
|
|
| JESD-609 Code |
e1
|
e0
|
| Length |
35 mm
|
|
| Moisture Sensitivity Level |
4
|
|
| Number of CLBs |
10000
|
|
| Number of Inputs |
600
|
|
| Number of Logic Cells |
128000
|
|
| Number of Outputs |
600
|
|
| Number of Terminals |
1156
|
|
| Organization |
10000 CLBS
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA1156,34X34,40
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.53 mm
|
|
| Supply Voltage-Max |
1.05 V
|
|
| Supply Voltage-Min |
0.95 V
|
|
| Supply Voltage-Nom |
1 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
TIN LEAD
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
35 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
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