XQ5VLX155T-1EF1136I vs XC5VLX155T-2FFG1136C feature comparison

XQ5VLX155T-1EF1136I AMD Xilinx

Buy Now Datasheet

XC5VLX155T-2FFG1136C AMD Xilinx

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FCBGA-1136 BGA-1136
Pin Count 1136 1136
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1098 MHz
Combinatorial Delay of a CLB-Max 0.9 ns 0.77 ns
JESD-30 Code S-PBGA-B1136 S-PBGA-B1136
JESD-609 Code e0 e1
Length 35 mm 35 mm
Number of CLBs 12160 12160
Number of Inputs 640 640
Number of Logic Cells 155648 155648
Number of Outputs 640 640
Number of Terminals 1136 1136
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1136,34X34,40 BGA1136,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 1 1
Moisture Sensitivity Level 4
Organization 12160 CLBS
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

Compare XQ5VLX155T-1EF1136I with alternatives

Compare XC5VLX155T-2FFG1136C with alternatives