XQ5VFX130T-1EF1738I vs XC5VFX130T-2FFG1738C feature comparison

XQ5VFX130T-1EF1738I AMD Xilinx

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XC5VFX130T-2FFG1738C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FCBGA-1738 BGA-1738
Pin Count 1738 1738
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1098 MHz
Combinatorial Delay of a CLB-Max 0.9 ns 0.77 ns
JESD-30 Code S-PBGA-B1738 S-PBGA-B1738
JESD-609 Code e0 e1
Length 42.5 mm 42.5 mm
Number of CLBs 11200 10240
Number of Inputs 840 840
Number of Logic Cells 131072 13172
Number of Outputs 840 840
Number of Terminals 1738 1738
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1738,42X42,40 BGA1738,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Moisture Sensitivity Level 4
Organization 10240 CLBS
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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Compare XC5VFX130T-2FFG1738C with alternatives