XQ2VP70-5FF1704N vs XC2VP70-6FF1704C feature comparison

XQ2VP70-5FF1704N AMD Xilinx

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XC2VP70-6FF1704C AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA1704,42X42,40 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
Pin Count 1704 1704
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.2.C 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1050 MHz 1200 MHz
Combinatorial Delay of a CLB-Max 0.36 ns 0.32 ns
JESD-30 Code S-PBGA-B1704 S-PBGA-B1704
JESD-609 Code e0 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 8272 8272
Number of Inputs 996 996
Number of Logic Cells 74448 74448
Number of Outputs 996 996
Number of Terminals 1704 1704
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C
Organization 8272 CLBS 8272 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1704,42X42,40 BGA1704,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.45 mm 3.45 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Pbfree Code No

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