XQ2VP70-5FF1704N
vs
XC2VP70-6FF1704C
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA1704,42X42,40
|
42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
|
Pin Count |
1704
|
1704
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.7.A
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
1050 MHz
|
1200 MHz
|
Combinatorial Delay of a CLB-Max |
0.36 ns
|
0.32 ns
|
JESD-30 Code |
S-PBGA-B1704
|
S-PBGA-B1704
|
JESD-609 Code |
e0
|
e0
|
Length |
42.5 mm
|
42.5 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of CLBs |
8272
|
8272
|
Number of Inputs |
996
|
996
|
Number of Logic Cells |
74448
|
74448
|
Number of Outputs |
996
|
996
|
Number of Terminals |
1704
|
1704
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
8272 CLBS
|
8272 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1704,42X42,40
|
BGA1704,42X42,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.45 mm
|
3.45 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Lead (Sn63Pb37)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
42.5 mm
|
42.5 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
|
|
|
Compare XQ2VP70-5FF1704N with alternatives
Compare XC2VP70-6FF1704C with alternatives