XQ17V16CC44M vs XC17V16PCG44I feature comparison

XQ17V16CC44M AMD Xilinx

Buy Now Datasheet

XC17V16PCG44I AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code LCC LCC
Package Description CERAMIC, LCC-44 QCCJ,
Pin Count 44 44
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A991.B.1.B.1
HTS Code 8542.32.00.61 8542.32.00.51
Access Time-Max 20 ns
Clock Frequency-Max (fCLK) 33 MHz
I/O Type COMMON
JESD-30 Code S-CQCC-J44 S-PQCC-J44
JESD-609 Code e0 e3
Length 16.51 mm 16.5862 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 2MX8 2MX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC44,.7SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL/SERIAL PARALLEL/SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm 4.57 mm
Standby Current-Max 0.001 A
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 16.51 mm 16.5862 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

Compare XQ17V16CC44M with alternatives

Compare XC17V16PCG44I with alternatives