XQ1704LPC44N
vs
XC1701LSOG20C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
QFN
SOIC
Package Description
QCCJ,
SOP,
Pin Count
44
20
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
JESD-30 Code
S-PQCC-J44
R-PDSO-G20
JESD-609 Code
e0
e3
Length
16.5862 mm
12.827 mm
Memory Density
4194304 bit
1048576 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
44
20
Number of Words
4194304 words
1048576 words
Number of Words Code
4000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
4MX1
1MX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
SOP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
2.6416 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
DUAL
Width
16.5862 mm
7.5184 mm
Base Number Matches
1
1
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare XQ1704LPC44N with alternatives
Compare XC1701LSOG20C with alternatives