XPC862PZP80 vs TSPC860SRMZPU80C1 feature comparison

XPC862PZP80 Motorola Mobility LLC

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TSPC860SRMZPU80C1 Teledyne e2v

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TELEDYNE E2V (UK) LTD
Part Package Code BGA BGA
Package Description BGA, BGA357,19X19,50 BGA,
Pin Count 357 357
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 80 MHz 80 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 357 357
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 2.05 mm
Speed 80 MHz 80 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Operating Temperature-Max 125 °C
Temperature Grade MILITARY

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