XPC860SRZP66D3 vs XPC860DPZP66D4 feature comparison

XPC860SRZP66D3 Freescale Semiconductor

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XPC860DPZP66D4 Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code BGA
Package Description BGA, BGA, BGA357,19X19,50
Pin Count 357
Reach Compliance Code unknown unknown
ECCN Code 5A991 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 66 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
Length 25 mm 25 mm
Low Power Mode YES
Number of Terminals 357 357
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 2.05 mm
Speed 66 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC SoC
Base Number Matches 3 3
Operating Temperature-Min
Package Equivalence Code BGA357,19X19,50

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