XPC860PCZP66D4
vs
TSPC860SRVZP66D
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
TELEDYNE E2V (UK) LTD
Part Package Code
BGA
BGA
Package Description
BGA, BGA357,19X19,50
BGA,
Pin Count
357
357
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
Length
25 mm
25 mm
Number of Terminals
357
357
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA357,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
2.05 mm
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
SoC
MICROPROCESSOR, RISC
Base Number Matches
3
2
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
Low Power Mode
YES
Speed
66 MHz
Compare XPC860PCZP66D4 with alternatives
Compare TSPC860SRVZP66D with alternatives