XPC860PCZP50D4
vs
XPC860ENCZP50D3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Part Package Code
BGA
Package Description
BGA, BGA357,19X19,50
PLASTIC, BGA-357
Pin Count
357
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
Length
25 mm
25 mm
Number of Terminals
357
357
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA357,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
2.05 mm
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
SoC
SoC
Base Number Matches
3
4
Rohs Code
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
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