XPC860MHZP66C1
vs
MPC860ENZP40
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Package Description
BGA, BGA357,19X19,50
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
JESD-609 Code
e0
Length
25 mm
25 mm
Number of Terminals
357
357
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA357,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
2.05 mm
Supply Voltage-Max
3.465 V
3.78 V
Supply Voltage-Min
3.135 V
2.85 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
SoC
MICROPROCESSOR, RISC
Base Number Matches
3
2
Address Bus Width
32
Bit Size
32
Clock Frequency-Max
40 MHz
External Data Bus Width
32
Operating Temperature-Max
70 °C
Speed
40 MHz
Temperature Grade
COMMERCIAL
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