Findchips: Compare XPC860DTZP50D3 vs MPC860SRCZQ50D4

XPC860DTZP50D3 vs MPC860SRCZQ50D4 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	MOTOROLA INC	FREESCALE SEMICONDUCTOR INC
Package Description	BGA,	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Reach Compliance Code	unknown	not_compliant
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
JESD-30 Code	S-PBGA-B357	S-PBGA-B357
JESD-609 Code	e0	e0
Length	25 mm	25 mm
Number of Terminals	357	357
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.05 mm	2.52 mm
Supply Voltage-Max	3.465 V	3.465 V
Supply Voltage-Min	3.135 V	3.135 V
Supply Voltage-Nom	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	TIN LEAD	Tin/Lead (Sn/Pb)
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	SoC	MICROPROCESSOR, RISC
Base Number Matches	3	3
Pbfree Code		No
Part Package Code		BGA
Pin Count		357
Address Bus Width		32
Bit Size		32
Boundary Scan		YES
Clock Frequency-Max		50 MHz
External Data Bus Width		32
Format		FIXED POINT
Integrated Cache		YES
Low Power Mode		YES
Moisture Sensitivity Level		3
Operating Temperature-Min		-40 °C
Package Equivalence Code		BGA357,19X19,50
Peak Reflow Temperature (Cel)		245
Speed		50 MHz
Time@Peak Reflow Temperature-Max (s)		30
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors