XPC860DEZP50D3
vs
MPC860ENCVR50D4
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
End Of Life
|
Ihs Manufacturer |
MOTOROLA INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
25 X 25 MM, 1.20 HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357
|
Pin Count |
357
|
357
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
50 MHz
|
50 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B357
|
S-PBGA-B357
|
JESD-609 Code |
e0
|
e1
|
Length |
25 mm
|
25 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
357
|
357
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.05 mm
|
2.52 mm
|
Speed |
50 MHz
|
50 MHz
|
Supply Voltage-Max |
3.465 V
|
3.465 V
|
Supply Voltage-Min |
3.135 V
|
3.135 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
25 mm
|
25 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
3
|
3
|
Pbfree Code |
|
No
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
245
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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