XPC850SRZT66B vs XPC850ZT66B feature comparison

XPC850SRZT66B Freescale Semiconductor

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XPC850ZT66B Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description BGA, BGA256,16X16,50 BGA, BGA256,16X16,50
Reach Compliance Code unknown unknown
Bit Size 32 32
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,50 BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Power Supplies 3.3 V
Qualification Status Not Qualified Not Qualified
Speed 66 MHz 66 MHz
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 4
Part Package Code BGA
Pin Count 256
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 26
Boundary Scan YES
Clock Frequency-Max 66 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Length 23 mm
Low Power Mode YES
Operating Temperature-Max 95 °C
Operating Temperature-Min
Seated Height-Max 2.35 mm
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Temperature Grade OTHER
Width 23 mm

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