XPC850SRZT50BU
vs
MPC850DSLCZQ50BU
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
BGA-256
23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
26
26
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
23 mm
23 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Operating Temperature-Max
95 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Seated Height-Max
2.35 mm
2.35 mm
Speed
50 MHz
50 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
3
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
256
ECCN Code
3A991.A.2
Clock Frequency-Max
50 MHz
JESD-609 Code
e0
Moisture Sensitivity Level
3
Package Equivalence Code
BGA256,16X16,50
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
40
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