XPC850SRCZT50BU vs 79RC32V334-133BBI feature comparison

XPC850SRCZT50BU Freescale Semiconductor

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79RC32V334-133BBI Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA256,16X16,50 27 X 27 MM, PLASTIC, BGA-256
Pin Count 256 256
Reach Compliance Code not_compliant not_compliant
ECCN Code 5A991
HTS Code 8542.31.00.01
Address Bus Width 26 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 66.67 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 23 mm 17 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm 3.5 mm
Speed 50 MHz 133 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 23 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 7
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Power Supplies 3.3 V
Supply Current-Max 630 mA
Temperature Grade INDUSTRIAL

Compare XPC850SRCZT50BU with alternatives

Compare 79RC32V334-133BBI with alternatives