XPC850CZT50BUR2 vs MCF53281CVM240 feature comparison

XPC850CZT50BUR2 Motorola Mobility LLC

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MCF53281CVM240 Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 17 X 17 MM, ROHS COMPLIANT, MAPBGA-256
Pin Count 256 256
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 5A992
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 26 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 80 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 23 mm 17 mm
Low Power Mode YES YES
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm 1.6 mm
Speed 50 MHz 240 MHz
Supply Voltage-Max 3.465 V 1.6 V
Supply Voltage-Min 3.135 V 1.4 V
Supply Voltage-Nom 3.3 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer NXP
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code BGA256,16X16,40
Peak Reflow Temperature (Cel) 260
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL
Time@Peak Reflow Temperature-Max (s) 40

Compare XPC850CZT50BUR2 with alternatives

Compare MCF53281CVM240 with alternatives