XPC8260ZUHFBB3
vs
MPC8272ZQMIBA
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
|
| Package Description |
LBGA,
|
|
| Pin Count |
480
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
66 MHz
|
|
| External Data Bus Width |
64
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B480
|
|
| Length |
37.5 mm
|
|
| Number of Terminals |
480
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Qualification Status |
COMMERCIAL
|
|
| Seated Height-Max |
1.65 mm
|
|
| Speed |
166 MHz
|
|
| Supply Voltage-Max |
2.7 V
|
|
| Supply Voltage-Min |
2.4 V
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
37.5 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
4
|
2
|
| Rohs Code |
|
No
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|