XPC8260AZUMIBA
vs
KXPC8260ACZUMHBA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
BGA
Package Description
LBGA,
BGA, BGA480,29X29,50
Pin Count
480
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
Clock Frequency-Max
66.66 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B480
S-PBGA-B480
JESD-609 Code
e0
e0
Length
37.5 mm
Low Power Mode
NO
Number of Terminals
480
480
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
Speed
266 MHz
266 MHz
Supply Voltage-Max
2.7 V
Supply Voltage-Min
2.4 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
37.5 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
3
Rohs Code
Package Equivalence Code
BGA480,29X29,50
Power Supplies
2.5,3.3 V
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