XPC8245TZU350D
vs
XPC8245LZU350LA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
LBGA,
|
BGA, BGA352,26X26,50
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
66 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
| Length |
35 mm
|
|
| Low Power Mode |
YES
|
|
| Number of Terminals |
352
|
352
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.65 mm
|
|
| Speed |
350 MHz
|
350 MHz
|
| Supply Voltage-Max |
2.1 V
|
|
| Supply Voltage-Min |
1.9 V
|
|
| Supply Voltage-Nom |
2 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
35 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
3
|
| Package Equivalence Code |
|
BGA352,26X26,50
|
| Power Supplies |
|
2,3.3 V
|
|
|
|
Compare XPC8245TZU350D with alternatives