XPC8245LZU266LB
vs
XPC8245LZU266LA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
BGA, BGA352,26X26,50
|
BGA, BGA352,26X26,50
|
| Reach Compliance Code |
unknown
|
unknown
|
| Bit Size |
32
|
32
|
| JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
| Number of Terminals |
352
|
352
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA352,26X26,50
|
BGA352,26X26,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Power Supplies |
1.8,3.3 V
|
1.8,3.3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
266 MHz
|
266 MHz
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
3
|
|
|
|