XPC8240LZU200E
vs
PC8240VTPU200EZD3
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TELEDYNE E2V (UK) LTD
|
Package Description |
,
|
LBGA,
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Technology |
CMOS
|
CMOS
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
5
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
352
|
Address Bus Width |
|
32
|
Bit Size |
|
32
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
66 MHz
|
External Data Bus Width |
|
32
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
YES
|
JESD-30 Code |
|
S-PBGA-B352
|
Length |
|
35 mm
|
Low Power Mode |
|
YES
|
Number of Terminals |
|
352
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LBGA
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.65 mm
|
Speed |
|
200 MHz
|
Supply Voltage-Max |
|
2.625 V
|
Supply Voltage-Min |
|
2.375 V
|
Supply Voltage-Nom |
|
2.5 V
|
Surface Mount |
|
YES
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
35 mm
|
|
|
|
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