XPC823ZT50
vs
MC9328MX1CVM15R2
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, MAPBGA-256
|
Pin Count |
256
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
26
|
25
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
50 MHz
|
16 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
23 mm
|
14 mm
|
Low Power Mode |
YES
|
NO
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.35 mm
|
1.6 mm
|
Supply Voltage-Max |
3.6 V
|
1.9 V
|
Supply Voltage-Min |
3 V
|
1.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
23 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
4
|
Rohs Code |
|
Yes
|
Package Equivalence Code |
|
BGA256,16X16,32
|
Speed |
|
150 MHz
|
Supply Voltage-Nom |
|
1.8 V
|
|
|
|
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