XPC823CZT25
vs
MPC870CZT66
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
PLASTIC, BGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
26
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
25 MHz
|
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
23 mm
|
23 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-45 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
HBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, HEAT SINK/SLUG
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.35 mm
|
2.54 mm
|
Supply Voltage-Max |
3.6 V
|
1.9 V
|
Supply Voltage-Min |
3 V
|
1.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
23 mm
|
23 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
ECCN Code |
|
5A992
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
BGA256,16X16,50
|
Peak Reflow Temperature (Cel) |
|
245
|
Speed |
|
66 MHz
|
Supply Voltage-Nom |
|
1.8 V
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XPC823CZT25 with alternatives
Compare MPC870CZT66 with alternatives