XPC7445RX733NC
vs
PCX7448VSH1267ND
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
TELEDYNE E2V (UK) LTD
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
BGA,
|
Pin Count |
360
|
360
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
36
|
36
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
200 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B360
|
S-CBGA-B360
|
Length |
25 mm
|
25 mm
|
Low Power Mode |
YES
|
NO
|
Number of Terminals |
360
|
360
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.2 mm
|
2.4 mm
|
Speed |
733 MHz
|
1267 MHz
|
Supply Voltage-Max |
1.35 V
|
1.1 V
|
Supply Voltage-Min |
1.25 V
|
1 V
|
Supply Voltage-Nom |
1.3 V
|
1.05 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
25 mm
|
25 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Operating Temperature-Max |
|
110 °C
|
Operating Temperature-Min |
|
-40 °C
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Temperature Grade |
|
INDUSTRIAL
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare XPC7445RX733NC with alternatives
Compare PCX7448VSH1267ND with alternatives