XCVU160-2FLGB2104C vs XCVU160-2FLGB2104E feature comparison

XCVU160-2FLGB2104C AMD

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XCVU160-2FLGB2104E AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Reach Compliance Code compliant not_compliant
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 2 2
Package Description FBGA-2104
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B2104
JESD-609 Code e1
Length 47.5 mm
Number of CLBs 1560
Number of Inputs 702
Number of Logic Cells 2026500
Number of Outputs 702
Number of Terminals 2104
Operating Temperature-Max 100 °C
Operating Temperature-Min
Organization 1560 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA2104,46X46,40
Package Shape SQUARE
Package Style GRID ARRAY
Seated Height-Max 4.32 mm
Supply Voltage-Max 0.979 V
Supply Voltage-Min 0.922 V
Supply Voltage-Nom 0.95 V
Surface Mount YES
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 47.5 mm

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