Findchips: Compare XCVU125-3FLVD1517I vs XCVU125-3FLVD1517E

XCVU125-3FLVD1517I vs XCVU125-3FLVD1517E feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Date Of Intro	2017-02-15
JESD-609 Code	e1	e1
Moisture Sensitivity Level	4	4
Peak Reflow Temperature (Cel)	245	245
Terminal Finish	TIN SILVER COPPER	TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)	30	30
Base Number Matches	1	1
Package Description		BGA-1517
ECCN Code		3A001.A.7.B
JESD-30 Code		S-PBGA-B1517
Length		40 mm
Number of CLBs		1200
Number of Inputs		884
Number of Logic Cells		1566600
Number of Outputs		884
Number of Terminals		1517
Operating Temperature-Max		100 °C
Operating Temperature-Min
Organization		1200 CLBS
Package Body Material		PLASTIC/EPOXY
Package Code		BGA
Package Equivalence Code		BGA1517,39X39,40
Package Shape		SQUARE
Package Style		GRID ARRAY
Programmable Logic Type		FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max		4.09 mm
Supply Voltage-Max		1.03 V
Supply Voltage-Min		0.97 V
Supply Voltage-Nom		1 V
Surface Mount		YES
Temperature Grade		OTHER
Terminal Form		BALL
Terminal Pitch		1 mm
Terminal Position		BOTTOM
Width		40 mm
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays