XCV50-4CSG144I
vs
XCV50-5CSG144I
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA,
|
TFBGA,
|
Pin Count |
144
|
144
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
250 MHz
|
294 MHz
|
Combinatorial Delay of a CLB-Max |
0.8 ns
|
0.7 ns
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
JESD-609 Code |
e1
|
e1
|
Length |
12 mm
|
12 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
384
|
384
|
Number of Equivalent Gates |
57906
|
57906
|
Number of Inputs |
94
|
94
|
Number of Outputs |
94
|
94
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
384 CLBS, 57906 GATES
|
384 CLBS, 57906 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA144,13X13,32
|
BGA144,13X13,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max |
2.625 V
|
2.625 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
12 mm
|
12 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare XCV50-4CSG144I with alternatives
Compare XCV50-5CSG144I with alternatives