XCV50-4CSG144C
vs
XCV50-6CSG144C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA,
Pin Count
144
144
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
250 MHz
333 MHz
Combinatorial Delay of a CLB-Max
0.8 ns
0.6 ns
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e1
e1
Length
12 mm
12 mm
Moisture Sensitivity Level
3
3
Number of CLBs
384
384
Number of Equivalent Gates
57906
57906
Number of Inputs
94
94
Number of Outputs
94
94
Number of Terminals
144
144
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
384 CLBS, 57906 GATES
384 CLBS, 57906 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA144,13X13,32
BGA144,13X13,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
12 mm
12 mm
Base Number Matches
1
1
Compare XCV50-4CSG144C with alternatives
Compare XCV50-6CSG144C with alternatives