XCV50-4CS144I
vs
XCV50-4CS144C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
CSP-144
CSP-144
Pin Count
144
144
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
250 MHz
250 MHz
Combinatorial Delay of a CLB-Max
0.8 ns
0.8 ns
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e0
e0
Length
12 mm
12 mm
Moisture Sensitivity Level
3
3
Number of CLBs
384
384
Number of Equivalent Gates
57906
57906
Number of Inputs
94
94
Number of Logic Cells
1728
1728
Number of Outputs
94
94
Number of Terminals
144
144
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
384 CLBS, 57906 GATES
384 CLBS, 57906 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA144,13X13,32
BGA144,13X13,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
240
240
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
12 mm
12 mm
Base Number Matches
1
1
Temperature Grade
OTHER
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