XCV400E-8BG432I vs XCV400E-8BGG432I feature comparison

XCV400E-8BG432I AMD Xilinx

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XCV400E-8BGG432I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-432 LBGA, BGA432,31X31,50
Pin Count 432 432
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 416 MHz 416 MHz
Combinatorial Delay of a CLB-Max 0.4 ns 0.4 ns
JESD-30 Code S-PBGA-B432 S-PBGA-B432
JESD-609 Code e0 e1
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2400 2400
Number of Equivalent Gates 129600 129600
Number of Inputs 316 316
Number of Logic Cells 10800 10800
Number of Outputs 316 316
Number of Terminals 432 432
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2400 CLBS, 129600 GATES 2400 CLBS, 129600 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA432,31X31,50 BGA432,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1

Compare XCV400E-8BG432I with alternatives

Compare XCV400E-8BGG432I with alternatives