XCV400E-6BGG432C vs XCV400E-8BG432C feature comparison

XCV400E-6BGG432C AMD Xilinx

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XCV400E-8BG432C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-432 BGA-432
Pin Count 432 432
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357 MHz 416 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.4 ns
JESD-30 Code S-PBGA-B432 S-PBGA-B432
JESD-609 Code e1 e0
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2400 2400
Number of Equivalent Gates 129600 129600
Number of Inputs 316 316
Number of Logic Cells 10800 10800
Number of Outputs 316 316
Number of Terminals 432 432
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2400 CLBS, 129600 GATES 2400 CLBS, 129600 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA432,31X31,50 BGA432,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1

Compare XCV400E-6BGG432C with alternatives

Compare XCV400E-8BG432C with alternatives