XCV400-4BG560C vs XCV400-5BGG560C feature comparison

XCV400-4BG560C AMD Xilinx

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XCV400-5BGG560C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-560 LBGA,
Pin Count 560 560
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 250 MHz 294 MHz
Combinatorial Delay of a CLB-Max 0.8 ns 0.7 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e0 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2400 2400
Number of Equivalent Gates 468252 468252
Number of Inputs 404
Number of Logic Cells 10800
Number of Outputs 404
Number of Terminals 560 560
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2400 CLBS, 468252 GATES 2400 CLBS, 468252 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

Compare XCV400-4BG560C with alternatives

Compare XCV400-5BGG560C with alternatives