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XCV300E-8FGG456C vs XCV300E-8FG456C feature comparison

XCV300E-8FGG456C AMD Xilinx

Buy Now Datasheet

XCV300E-8FG456C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-456 FBGA-456
Pin Count 456 456
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 416 MHz 416 MHz
Combinatorial Delay of a CLB-Max 0.4 ns 0.4 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e1 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1536 1536
Number of Equivalent Gates 82944 82944
Number of Inputs 312 312
Number of Logic Cells 6912 6912
Number of Outputs 312 312
Number of Terminals 456 456
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1536 CLBS, 82944 GATES 1536 CLBS, 82944 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

Compare XCV300E-8FGG456C with alternatives

Compare XCV300E-8FG456C with alternatives