XCV300E-8FG256C
vs
XCV300E-6FGG256I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-256
BGA, BGA256,16X16,40
Pin Count
256
256
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
416 MHz
357 MHz
Combinatorial Delay of a CLB-Max
0.4 ns
0.47 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1536
1536
Number of Equivalent Gates
82944
82944
Number of Inputs
176
176
Number of Logic Cells
6912
6912
Number of Outputs
176
176
Number of Terminals
256
256
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
1536 CLBS, 82944 GATES
1536 CLBS, 82944 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
2 mm
Supply Voltage-Max
1.89 V
1.89 V
Supply Voltage-Min
1.71 V
1.71 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
17 mm
Base Number Matches
1
1
Compare XCV300E-8FG256C with alternatives
Compare XCV300E-6FGG256I with alternatives