XCV300E-8BGG352C vs XCV300E-6BG352C feature comparison

XCV300E-8BGG352C AMD Xilinx

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XCV300E-6BG352C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, BGA-352
Pin Count 352 352
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 416 MHz 357 MHz
Combinatorial Delay of a CLB-Max 0.4 ns 0.47 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1536 1536
Number of Equivalent Gates 82944 82944
Number of Inputs 260 260
Number of Outputs 260 260
Number of Terminals 352 352
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1536 CLBS, 82944 GATES 1536 CLBS, 82944 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1
Number of Logic Cells 6912

Compare XCV300E-8BGG352C with alternatives

Compare XCV300E-6BG352C with alternatives