XCV300E-6BG352I vs XCV300E-6BGG352C feature comparison

XCV300E-6BG352I AMD Xilinx

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XCV300E-6BGG352C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-352 BGA-352
Pin Count 352 352
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357 MHz 357 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.47 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1536 1536
Number of Equivalent Gates 82944 82944
Number of Inputs 260 260
Number of Logic Cells 6912 6912
Number of Outputs 260 260
Number of Terminals 352 352
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1536 CLBS, 82944 GATES 1536 CLBS, 82944 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1
Temperature Grade OTHER

Compare XCV300E-6BG352I with alternatives

Compare XCV300E-6BGG352C with alternatives