XCV2000E-8FG860C
vs
XCV2000E-7FG860C
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
FBGA-860
|
FBGA-860
|
Pin Count |
860
|
860
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
416 MHz
|
400 MHz
|
Combinatorial Delay of a CLB-Max |
0.4 ns
|
0.42 ns
|
JESD-30 Code |
S-PBGA-B860
|
S-PBGA-B860
|
JESD-609 Code |
e0
|
e0
|
Length |
42.5 mm
|
42.5 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
9600
|
9600
|
Number of Equivalent Gates |
518400
|
518400
|
Number of Inputs |
660
|
660
|
Number of Logic Cells |
43200
|
43200
|
Number of Outputs |
660
|
660
|
Number of Terminals |
860
|
860
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
9600 CLBS, 518400 GATES
|
9600 CLBS, 518400 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA860,42X42,40
|
BGA860,42X42,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.2 mm
|
2.2 mm
|
Supply Voltage-Max |
1.89 V
|
1.89 V
|
Supply Voltage-Min |
1.71 V
|
1.71 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Lead (Sn63Pb37)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
42.5 mm
|
42.5 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare XCV2000E-8FG860C with alternatives
Compare XCV2000E-7FG860C with alternatives