XCV2000E-7FGG860I
vs
XCV2000E-6FG860I
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA860,42X42,40
|
FBGA-860
|
| Pin Count |
860
|
860
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
400 MHz
|
357 MHz
|
| Combinatorial Delay of a CLB-Max |
0.42 ns
|
0.47 ns
|
| JESD-30 Code |
S-PBGA-B860
|
S-PBGA-B860
|
| JESD-609 Code |
e1
|
e0
|
| Length |
42.5 mm
|
42.5 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
9600
|
9600
|
| Number of Equivalent Gates |
518400
|
518400
|
| Number of Inputs |
660
|
|
| Number of Logic Cells |
43200
|
|
| Number of Outputs |
660
|
|
| Number of Terminals |
860
|
860
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
9600 CLBS, 518400 GATES
|
9600 CLBS, 518400 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA860,42X42,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
2.2 mm
|
2.2 mm
|
| Supply Voltage-Max |
1.89 V
|
1.89 V
|
| Supply Voltage-Min |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
42.5 mm
|
42.5 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare XCV2000E-7FGG860I with alternatives