XCV2000E-6FGG680I vs XCV2000E-7FGG680C feature comparison

XCV2000E-6FGG680I AMD Xilinx

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XCV2000E-7FGG680C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA680,39X39,40 BGA, BGA680,39X39,40
Pin Count 680 680
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357 MHz 400 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.42 ns
JESD-30 Code S-PBGA-B680 S-PBGA-B680
JESD-609 Code e1 e1
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 9600 9600
Number of Equivalent Gates 518400 518400
Number of Inputs 512 512
Number of Logic Cells 43200 43200
Number of Outputs 512 512
Number of Terminals 680 680
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 9600 CLBS, 518400 GATES 9600 CLBS, 518400 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA680,39X39,40 BGA680,39X39,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.9 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1
Temperature Grade OTHER

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Compare XCV2000E-7FGG680C with alternatives