XCV200-5BGG256C
vs
XCV200-6BGG256I
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
BGA,
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
294 MHz
|
333 MHz
|
| Combinatorial Delay of a CLB-Max |
0.7 ns
|
0.6 ns
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
e1
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
1176
|
1176
|
| Number of Equivalent Gates |
236666
|
236666
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
1176 CLBS, 236666 GATES
|
1176 CLBS, 236666 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
250
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.55 mm
|
2.55 mm
|
| Supply Voltage-Max |
2.625 V
|
2.625 V
|
| Supply Voltage-Min |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XCV200-5BGG256C with alternatives
Compare XCV200-6BGG256I with alternatives